Focus on the details丨Using failure analysis to find the crux of production problems

Release time:

2023-11-27 17:42

Source:

Electronic component failure is defined as complete or partial loss of function, parameter drift, or intermittent occurrence of the above conditions. Electronic component analysis is an after-the-fact check of a failed component. As needed, electrical testing and necessary physical, metallurgical and chemical analysis techniques are used to verify the reported failure, confirm the failure mode and identify the failure mechanism.

The main objects of analysis include semiconductor discrete devices such as resistors, capacitors, inductors, connectors, MOS, relays, diodes, transistors, SCRs, etc., integrated circuits of various sizes and package forms, RF and microwave devices, power modules, optoelectronic modules and other components and modules.

I. Case background

The customer has a batch of sold stock chips, the buyer uses the batch of chips for production operations, PL-2 power failure, flame failure, no light or key failure phenomenon, and the defective rate is as high as 60%. In order to find out the problem, the PCB board was tested with a jig, and it was found that some of the boards needed to be powered off 4-6 times before the phenomenon occurred.

Then, the buyer removed the microcontroller on the normal PCB assembly and switched it to the defective PCB assembly, and the function of the PCB assembly returned to normal.

The IC removed from the defective PCB assembly was still NG when the program was re-programmed, so the buyer guessed that the quality of the microcontroller was the problem.

Therefore, the buyer returned the batch of products, the customer in order to confirm the cause of production failure is caused by the chip itself, commissioned us to assist in analyzing the cause of failure.

Analysis process

1.Appearance analysis

Appearance test on the failed sample provided by the client to confirm whether there are obvious abnormalities on its surface.

Test results: From the appearance of the defective samples, no breakage phenomenon is found, and no microcontroller screen printing ghosting, blurring and other problems.

Hardcore! Component static parameter testing is so easy!

Chips fail as soon as you put them on the machine? Watch me use these six steps to find out the real reason for failure.

Component DPA testing can help manufacturers to detect possible vulnerabilities and security risks in the device, thus improving the security and reliability of the device. This article collects and organizes some information, which is expected to be of great reference value to all readers.

Standards for DPA testing of electronic components

Electronic component DPA (Destructive Physical Analysis) detection is a method of physically analyzing electronic components to determine the cause and mechanism of their failure. Unlike DPA attacks that target an entire cryptographic device, component DPA testing focuses on analyzing the power consumption variations of individual electronic components. The following is a detailed description of the standards for DPA testing of electronic components.

Damp heat test method and its related standards

Damp heat testing is a method used to test the resistance of materials, products and equipment to hot and humid environments. In a damp heat test, the sample will be exposed to high temperature and high humidity to simulate the damp heat environment under actual application conditions. Component damp heat testing can be used to evaluate the durability, reliability and life expectancy of components, which is of great significance for the design and manufacture of electronic products.

Analysis of dpa testing of electronic components

DPA (Destructive Physical Analysis) testing and analysis of electronic components is a method of determining the cause and mechanism of failure of electronic components through physical analysis. In modern electronic products, electronic components are the basic components of the circuit, and their failure will lead to the failure of the entire circuit, which in turn affects the performance and reliability of the entire electronic product. Therefore, the failure analysis and non-destructive testing of electronic components is particularly important.

How to inspect and screen electronic components?

What conditions require component dpa testing?

During the design and development phase, manufacturers need to conduct thorough security assessment and testing of their devices. Component DPA testing is an important testing method that can help manufacturers detect possible vulnerabilities and security risks in devices. By performing component DPA testing, manufacturers can identify and resolve security issues in their devices at an early stage, thus improving the safety and reliability of their devices.