Standards for DPA testing of electronic components

Release time:

2023-11-27 17:51

Source:

Electronic component DPA (Destructive Physical Analysis) detection is a method of physically analyzing electronic components to determine the cause and mechanism of their failure. Unlike DPA attacks that target an entire cryptographic device, component DPA testing focuses on analyzing the power consumption variations of individual electronic components. The following is a detailed description of the standards for DPA testing of electronic components.

1. MIL-STD-1580: This standard is issued by the U.S. Department of Defense and is mainly applicable to DPA inspection of military electronic components. The standard specifies the process, methods and standards for DPA inspection of components, including the appearance inspection, size inspection, material analysis, metal structure analysis and internal structure analysis of components.

2. MIL-STD-883: This standard is issued by the U.S. Department of Defense and is mainly applicable to DPA inspection of semiconductor devices. The standard specifies the process, methods and standards for DPA inspection of semiconductor devices, including aspects of component appearance inspection, dimensional inspection, material analysis, metal structure analysis and internal structure analysis.

3. JEDEC JESD22-A104: This standard is published by JEDEC Solid State Technology Association and is mainly applicable to DPA testing of semiconductor devices. The standard specifies the process, methods and standards for DPA testing of semiconductor devices, including aspects of component appearance testing, dimensional testing, material analysis, metal structure analysis and internal structure analysis.

4. IPC-9702: This standard is issued by IPC (Association Connecting Electronics Industries) and is mainly applicable to DPA inspection of electronic components. The standard specifies the process, methods and standards for DPA inspection of electronic components, including the appearance inspection, dimensional inspection, material analysis, metal structure analysis and internal structure analysis of components.

5.NASA-STD-8739.1: This standard is issued by NASA and is mainly applicable to DPA inspection of aerospace electronic components. The standard specifies the process, methods and standards for DPA inspection of aerospace electronic components, including aspects such as appearance inspection, dimensional inspection, material analysis, metal structure analysis and internal structure analysis of components.

Component DPA routine testing items and principles

Damp heat test method and its related standards

Component DPA testing can help manufacturers to detect possible vulnerabilities and security risks in the device, thus improving the security and reliability of the device. This article collects and organizes some information, which is expected to be of great reference value to all readers.

Standards for DPA testing of electronic components

Damp heat test method and its related standards

Damp heat testing is a method used to test the resistance of materials, products and equipment to hot and humid environments. In a damp heat test, the sample will be exposed to high temperature and high humidity to simulate the damp heat environment under actual application conditions. Component damp heat testing can be used to evaluate the durability, reliability and life expectancy of components, which is of great significance for the design and manufacture of electronic products.

Analysis of dpa testing of electronic components

DPA (Destructive Physical Analysis) testing and analysis of electronic components is a method of determining the cause and mechanism of failure of electronic components through physical analysis. In modern electronic products, electronic components are the basic components of the circuit, and their failure will lead to the failure of the entire circuit, which in turn affects the performance and reliability of the entire electronic product. Therefore, the failure analysis and non-destructive testing of electronic components is particularly important.

How to inspect and screen electronic components?

What conditions require component dpa testing?

During the design and development phase, manufacturers need to conduct thorough security assessment and testing of their devices. Component DPA testing is an important testing method that can help manufacturers detect possible vulnerabilities and security risks in devices. By performing component DPA testing, manufacturers can identify and resolve security issues in their devices at an early stage, thus improving the safety and reliability of their devices.